Thin film transistor, thin film transistor array panel including the same, and method of manufacturing the same

ABSTRACT

A thin film transistor, a thin film transistor array panel including the same, and a method of manufacturing the same are provided, wherein the thin film transistor includes a channel region including an oxide semiconductor, a source region and a drain region connected to the channel region and facing each other at both sides with respect to the channel region, an insulating layer positioned on the channel region, and a gate electrode positioned on the insulating layer, wherein an edge boundary of the gate electrode and an edge boundary of the channel region are substantially aligned.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. Application of U.S.application Ser. No. 14/468,472 filed on Aug. 26, 2014, which is acontinuation of U.S. patent application Ser. No. 14/166,183 filed onJan. 28, 2014, which is a continuation of U.S. patent application Ser.No. 13/553,418 filed on Jul. 19, 2012, which claims priority to KoreanPatent Application No. 10-2012-0034099 filed in the Korean IntellectualProperty Office on Apr. 2, 2012, the disclosures of which areincorporated by reference herein in their entireties.

TECHNICAL FIELD

Embodiments of the present invention relate to a thin film transistor, athin film transistor array panel including the same, and a method ofmanufacturing the same.

DISCUSSION OF THE RELATED ART

Thin film transistors (TFTs) are used in various electronic devices,such as flat panel displays. For example, thin film transistors are usedas switching elements or driving elements in a flat panel display, suchas a liquid crystal display (LCD), an organic light emitting diode(OLED) display, and an electrophoretic display.

A thin film transistor includes a gate electrode connected to a gateline to transmit a scanning signal, a source electrode connected to adata line to transmit a signal applied to a pixel electrode, a drainelectrode that faces the source electrode, and a semiconductorelectrically connected to the source electrode and the drain electrode.

The semiconductor is a factor in determining characteristics of the thinfilm transistor. The semiconductor may include silicon (Si). The siliconmay be amorphous silicon or polysilicon according to a crystallizationtype thereof. Amorphous silicon allows for a simpler manufacturingprocess and has relatively low charge mobility. Polysilicon, which hasrelatively high charge mobility, is subjected to a crystallizingprocess, such that manufacturing cost is increased and the process iscomplicated.

To address the properties of amorphous silicon and polysilicon, there isresearch on thin film transistors using an oxide semiconductor havinghigh uniformity. The oxide semiconductor can have higher electronmobility, a higher ON/OFF ratio, and a lower cost than those ofamorphous silicon and/or polysilicon.

If parasitic capacitance is generated between the gate electrode and thesource electrode or the drain electrode of a thin film transistor,characteristics of the thin film transistor as a switching element maybe deteriorated.

SUMMARY

Embodiments of the present invention improve characteristics of a thinfilm transistor including an oxide semiconductor.

A thin film transistor according to an exemplary embodiment of thepresent invention includes a channel region including an oxidesemiconductor, a source region and a drain region respectively connectedto two opposite sides of the channel region, wherein the source regionand the drain region face each other, an insulating layer on the channelregion, and a gate electrode on the insulating layer, wherein an edge ofthe gate electrode is aligned or substantially aligned with an edge ofthe channel region.

A thin film transistor array panel according to an exemplary embodimentof the present invention includes an insulation substrate, a channelregion on the insulation substrate, the channel region including anoxide semiconductor, a source region and a drain region respectivelyconnected to two opposite sides of the channel region, wherein thesource region and the drain region face each other, an insulating layeron the channel region, and a gate electrode on the insulating layer,wherein an edge of the gate electrode is aligned or substantiallyaligned with an edge of the channel region.

The source region and the drain region may include a reduced material ofthe channel region.

The edge of the gate electrode is aligned or substantially aligned withan edge of the insulating layer.

A buffer layer may be further positioned between the insulationsubstrate and the channel region.

At least one of the buffer layer or the insulating layer may include aninsulating oxide.

A method of manufacturing a thin film transistor according to anexemplary embodiment of the present invention includes forming asemiconductor pattern including an oxide semiconductor material, formingan insulating layer and a gate electrode that traverse each other andoverlap the semiconductor pattern, and performing a reduction process onthe semiconductor pattern that is not covered by the insulating layerand the gate electrode to form a channel region covered by the gateelectrode and to form a source region and a drain region facing eachother with respect to the channel region.

Forming the insulating layer and the gate electrode may include formingan insulating material layer including an insulating material on thesemiconductor pattern, forming the gate electrode on the insulatingmaterial layer, and patterning the insulating material layer by usingthe gate electrode as an etching mask to form the insulating layer andto expose a portion of the semiconductor pattern.

Forming the semiconductor pattern and the forming of the insulatinglayer and the gate electrode may include sequentially depositing asemiconductor material layer including an oxide semiconductor material,an insulating material layer including an insulating material, and agate layer including a conductive material, sequentially etching thegate layer, the insulating material layer, and the semiconductormaterial layer by using a photomask to form the semiconductor pattern,and etching the gate layer and the insulating material layer to expose aportion of the semiconductor pattern.

Forming of the semiconductor pattern and the etching of the gate layerand the insulating material layer to expose the portion of thesemiconductor pattern may include forming a first photosensitive filmpattern including a first portion and a second portion that is thinnerthan the first portion on the gate layer, sequentially etching the gatelayer, the insulating material layer, and the semiconductor materiallayer by using the first photosensitive film pattern as an etching maskto form a gate pattern, an insulating pattern, and the semiconductorpattern, removing the second portion of the first photosensitive filmpattern to form a second photosensitive film pattern, and etching thegate pattern and the insulating pattern by using the secondphotosensitive film pattern as an etching mask to expose a portion ofthe semiconductor pattern.

A method of manufacturing a thin film transistor array panel accordingto an exemplary embodiment of the present invention includes depositinga semiconductor material layer including an oxide semiconductor materialon an insulation substrate and patterning the semiconductor materiallayer to form a semiconductor pattern, depositing an insulating materialon the semiconductor pattern to form an insulating material layer,forming a gate electrode on the insulating material layer, patterningthe insulating material layer by using the gate electrode as an etchingmask to form an insulating layer and to expose a portion of thesemiconductor pattern, and performing a reduction process on the exposedportion of the semiconductor pattern to form a channel region covered bythe gate electrode and to form a source region and a drain region facingeach other with respect to the channel region.

Forming the channel region, the source region, and the drain region mayinclude a reduction treatment method using plasma.

The method may include forming a buffer layer including an insulatingoxide on the insulation substrate before forming the semiconductorpattern.

Forming the channel region, the source region, and the drain region mayinclude extracting a metal component of the oxide semiconductor materialto a surface of at least one of the source region and the drain region.

A method of manufacturing a thin film transistor array panel accordingto an exemplary embodiment of the present invention includessequentially forming a semiconductor material layer including an oxidesemiconductor material, an insulating material layer including aninsulating material, and a gate layer including a conductive material,forming a first photosensitive film pattern including a first portionand a second portion that is thinner than the first portion on the gatelayer, sequentially etching the gate layer, the insulating materiallayer, and the semiconductor material layer by using the firstphotosensitive film pattern as an etching mask to form a gate pattern,an insulating pattern, and a semiconductor pattern, removing the secondportion of the first photosensitive film pattern to form a secondphotosensitive film pattern, etching the gate pattern and the insulatingpattern by using the second photosensitive film pattern as an etchingmask to expose a portion of the semiconductor pattern, and performing areduction process on the exposed portion of the semiconductor pattern toform a channel region covered by the gate electrode and to form a sourceregion and a drain region facing each other with respect to the channelregion.

The first portion and the second portion may be connected to each other.

Forming the channel region, the source region, and the drain region mayinclude a reduction treatment method using plasma.

Forming the channel region, the source region, and the drain region mayinclude extracting a metal component of the oxide semiconductor materialto a surface of at least one of the source region and the drain region.

According to an embodiment, there is provided a thin film transistorincluding a substrate, a semiconductor pattern including a sourceregion, a drain region, and a channel region between the source regionand the drain region, and a gate electrode on the semiconductor pattern,wherein the gate electrode overlaps the channel region but does notoverlap the source region or the drain region.

The thin film transistor may further include a light blocking filmbetween the substrate and the semiconductor pattern, wherein thesemiconductor pattern overlaps the light blocking film.

According to the exemplary embodiments of the present invention, theparasitic capacitance between the gate electrode and a source region ora drain region of a semiconductor layer of a thin film transistor may bereduced such that the characteristics of the thin film transistor may beimproved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a cross-sectional view illustrating a thin film transistorarray panel including a thin film transistor according to an exemplaryembodiment of the present invention,

FIG. 1B is a plan view of the thin film transistor array panel of FIG.1A,

FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG. 6, FIG. 7, FIG. 8, FIG. 9, and FIG.10 are cross-sectional views sequentially showing a method ofmanufacturing the thin film transistor array panel shown in FIG. 1according to an exemplary embodiment of the present invention,

FIG. 11 is a cross-sectional view illustrating a thin film transistorarray panel including a thin film transistor according to an exemplaryembodiment of the present invention,

FIG. 12, FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17, FIG. 18, FIG. 19,and FIG. 20 are cross-sectional views sequentially showing a method ofmanufacturing the thin film transistor array panel shown in FIG. 11according to an exemplary embodiment of the present invention,

FIG. 21 is a graph illustrating a voltage-current characteristic of athin film transistor according to an exemplary embodiment of the presentinvention, and

FIG. 22 is a graph illustrating a voltage-current characteristicaccording to various source-drain voltages of a thin film transistoraccording to an exemplary embodiment of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The embodiments of the present invention will be hereinafter describedin greater detail with reference to the accompanying drawings. As thoseskilled in the art would realize, the described embodiments may bemodified in various different ways, all without departing from thespirit or scope of the present invention.

In the drawings, the thickness of layers, films, panels, regions, etc.,may be exaggerated for clarity. Like reference numerals may designatelike or similar elements throughout the specification and the drawings.It will be understood that when an element such as a layer, film,region, or substrate is referred to as being “on”, “connected to”, or“coupled to” another element, it can be directly on, connected orcoupled to the other element or intervening elements may also bepresent.

As used herein, the singular forms, “a”, “an”, and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise.

As will be appreciated by one skilled in the art, embodiments of thepresent invention may be embodied as a system, method, computer programproduct, or a computer program product embodied in one or more computerreadable medium(s) having computer readable program code embodiedthereon. The computer readable program code may be provided to aprocessor of a general purpose computer, special purpose computer, orother programmable data processing apparatus. The computer readablemedium may be a computer readable signal medium or a computer readablestorage medium. The computer readable storage medium may be any tangiblemedium that can contain, or store a program for use by or in connectionwith an instruction execution system, apparatus, or device.

FIG. 1A is a cross-sectional view illustrating a thin film transistorarray panel including a thin film transistor according to an exemplaryembodiment of the present invention, and FIG. 1B is a plan view of thethin film transistor array panel of FIG. 1A.

Referring to FIG. 1A, a light blocking film 70 is positioned on aninsulation substrate 110 made of glass or plastic. The light blockingfilm 70 prevents or inhibits light from reaching an oxide semiconductorincluded in a channel region to thereby prevent the oxide semiconductorfrom losing its characteristics. According to an embodiment, the lightblocking film 70 is made of a material that does not transmit light of apredetermined wavelength band so that light does not reach the oxidesemiconductor. According to an embodiment, the light blocking film 70 ismade of an organic insulating material, an inorganic insulatingmaterial, or a conductive material, such as a metal, and according to anembodiment, includes a single layer or multiple layers.

According to an embodiment, the light blocking film 70 is omitted. Forexample, when there is no light irradiation from under the insulationsubstrate 110, for example, when the thin film transistor according toan exemplary embodiment of the present invention is used for an organiclight emitting device, the light blocking film 70 is omitted.

A buffer layer 120 is positioned on the light blocking film 70.According to an embodiment, the buffer layer 120 includes an insulatingoxide, such as silicon oxide (SiOx), aluminum oxide (Al₂O₃), hafniumoxide (HfO₃), and yttrium oxide (Y₂O₃). The buffer layer 120 prevents animpurity from the insulation substrate 110 from flowing into asemiconductor to be deposited later, thereby protecting thesemiconductor and improving an interface characteristic of thesemiconductor. A thickness of the buffer layer 120 is in a range of morethan about 500 μm to less than about 1 μm, but is not limited thereto.

A semiconductor layer including a channel region 134, a source region133, and a drain region 135 is formed on the buffer layer 120.

The semiconductor layer includes an oxide semiconductor material. Theoxide semiconductor material includes a metal oxide semiconductor madeof a metal oxide of zinc (Zn), indium (In), gallium (Ga), tin (Sn), ortitanium (Ti), or a combination of the metal of zinc (Zn), indium (In),gallium (Ga), tin (Sn), titanium (Ti), and the metal oxide thereof. Forexample, according to an embodiment, the oxide semiconductor materialincludes at least one of zinc oxide (ZnO), zinc-tin oxide (ZTO),zinc-indium oxide (ZIO), indium oxide (InO), titanium oxide (TiO),indium-gallium-zinc oxide (IGZO), and indium-zinc-tin oxide (IZTO).

The channel region 134 overlaps the light blocking film 70.

Referring to FIGS. 1A and 1B, the source region 133 and the drain region135 are respectively positioned at two sides of the channel region 134and are separated from each other. The source region 133 and the drainregion 135 are connected to the channel region 134.

The source region 133 and the drain region 135 have conductivity andinclude a semiconductor material forming the channel region 134 and areduced semiconductor material of the channel region 134. A metal, suchas indium (In), included in the semiconductor material may be extractedto a surface of at least one of the source region 133 and the drainregion 135.

An insulating layer 142 is positioned on the channel region 134. Theinsulating layer 142 covers the channel region 134. The insulating layer142 does not overlap or substantially does not overlap the source region133 or the drain region 135.

According to an embodiment, the insulating layer 142 includes asingle-layered structure or a multilayered structure having at least twolayers.

When the insulating layer 142 includes a single-layered structure, theinsulating layer 142 includes an insulating oxide, such as silicon oxide(SiOx), aluminum oxide (Al₂O₃), hafnium oxide (HfO₃), and yttrium oxide(Y₂O₃). The insulating layer 142 improves interface characteristics ofthe channel region 134 and prevents an impurity from penetrating intothe channel region 134.

When the insulating layer 142 includes a multilayered structure, theinsulating layer 142 includes a lower layer 142 a and an upper layer 142b as shown in FIG. 1A. The lower layer 142 a includes an insulatingoxide, such as silicon oxide (SiOx), aluminum oxide (Al₂O₃), hafniumoxide (HfO₃), and yttrium oxide (Y₂O₃), such that the interfacecharacteristic of the channel region 134 may be improved and thepenetration of the impurity into the channel region 134 may beprevented. According to an embodiment, the upper layer 142 b is made ofvarious insulating materials, such as silicon nitride (SiNx) and siliconoxide (SiOx). For example, according to an embodiment, the insulatinglayer 142 includes a lower layer of aluminum oxide (AlOx), which has,but is not limited to, a thickness of less than about 500 Å, and anupper layer of silicon oxide (SiOx), which has, but is not limited to, athickness of more than about 500 Å to less than about 1500 Å.Alternatively, the insulating layer 142 includes a lower layer ofsilicon oxide (SiOx), which has, but is not limited to, a thickness ofabout 2000 Å, and an upper layer of silicon nitride (SiNx), which has,but is not limited to, a thickness of about 1000 Å.

According to an embodiment, a thickness of the insulating layer 142 ismore than 1000 Å to less than 5000 Å, but is not limited thereto. Anentire thickness of the insulating layer 142 is controlled to maximizethe characteristics of the thin film transistor.

A gate electrode 154 is positioned on the insulating layer 142. An edgeof the gate electrode 154 and an edge of the insulating layer 142 arealigned or substantially aligned with each other.

Referring to FIGS. 1A and 1B, the gate electrode 154 includes a portionoverlapping the channel region 134, and the channel region 134 iscovered by the gate electrode 154. The source region 133 and the drainregion 135 are positioned at two sides of the channel region 134 withrespect to the gate electrode 154, and the source region 133 and thedrain region 135 do not overlap or do not substantially overlap the gateelectrode 154. Accordingly, the parasitic capacitance between the gateelectrode 154 and the source region 133 or the parasitic capacitancebetween the gate electrode 154 and the drain region 135 may bedecreased.

According to an embodiment, the gate electrode 154 is made of a metal,such as aluminum (Al), silver (Ag), copper (Cu), molybdenum (Mo),chromium (Cr), tantalum (Ta), and titanium (Ti), or alloys thereof. Thegate electrode 154 has a single-layered or multilayered structure.According to an embodiment, the multilayered structure includes adouble-layered structure including a lower layer of titanium (Ti),tantalum (Ta), molybdenum (Mo), or ITO and an upper layer of copper(Cu). According to an embodiment, when the gate electrode includes amultilayered structure, the gate electrode includes a triple-layeredstructure of molybdenum (Mo)-aluminum (Al)-molybdenum (Mo). According toan embodiment, the gate electrode 154 is made of various metals orconductors.

According to an exemplary embodiment of the present invention, aboundary between the channel region 134 and the source region 133 or aboundary between the channel region 134 and the drain region 135 arealigned or substantially aligned with an edge of the gate electrode 154or the insulating layer 142. Alternatively, the boundary between thechannel region 134 and the source region 133 or the drain region 135 ispositioned more inwardly with respect to the edge of the gate electrode154 or the insulating layer 142.

The gate electrode 154, the source region 133, and the drain region 135form a thin film transistor (TFT) Q along with the channel region 134,and a channel of the thin film transistor is formed in the channelregion 134.

A passivation layer 160 is positioned on the gate electrode 154, thesource region 133, the drain region 135, and the buffer layer 120.According to an embodiment, the passivation layer 160 is made of aninorganic insulating material, such as silicon nitride or silicon oxide,or an organic insulating material. The passivation layer 160 has acontact hole 163 exposing the source region 133 and a contact hole 165exposing the drain region 135.

A data input electrode 173 and a data output electrode 175 arepositioned on the passivation layer 160. The data input electrode 173 isalso referred to as a source electrode, and the data output electrode175 is also referred to as a drain electrode

The data input electrode 173 is electrically connected to the sourceregion 133 of the thin film transistor Q through the contact hole 163 ofthe passivation layer 160, and the data output electrode 175 iselectrically connected to the drain region 135 of the thin filmtransistor Q through the contact hole 165 of the passivation layer 160.

Alternatively, a color filter (not shown) or an organic layer (notshown) made of an organic material is further positioned on thepassivation layer 160, and the data input electrode 173 and the dataoutput electrode 175 are positioned on the color filter or organiclayer. Alternatively, at least one of the data input electrode 173 andthe data output electrode 175 is omitted.

A method of manufacturing the thin film transistor array panel shown inFIG. 1 according to an exemplary embodiment of the present invention isdescribed with reference to FIG. 2 to FIG. 9 as well as FIG. 1.

FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG. 6, FIG. 7, FIG. 8, FIG. 9, and FIG.10 are cross-sectional views sequentially showing a method ofmanufacturing the thin film transistor array panel shown in FIG. 1according to an exemplary embodiment of the present invention.

Referring to FIG. 2, the light blocking film 70 made of an organicinsulating material, an inorganic insulating material, or a conductivematerial, such as a metal, is formed on the insulation substrate 110made of glass or plastic. According to an embodiment, the forming of thelight blocking film 70 is omitted according to the condition.

Referring to FIG. 3, the buffer layer 120 made of an insulating materialincluding an oxide, such as silicon oxide (SiOx), aluminum oxide(Al₂O₃), hafnium oxide (HfO₃), and yttrium oxide (Y₂O₃), is formed onthe light blocking film 70 by a chemical vapor deposition (CVD) method.A thickness of the buffer layer 120 is in a range more than about 500 μmto less than about 1 μm, but is not limited thereto.

Referring to FIG. 4, a semiconductor material layer 130 made of an oxidesemiconductor material, such as zinc oxide (ZnO), zinc-tin oxide (ZTO),zinc-indium oxide (ZIO), indium oxide (InO), titanium oxide (TiO),indium-gallium-zinc oxide (IGZO), and indium-zinc-tin oxide (IZTO), iscoated on the buffer layer 120.

A photosensitive film including a photoresist is coated on thesemiconductor material layer 130 and is exposed to light, resulting in aphotosensitive film pattern 50. The photosensitive film pattern 50overlaps at least a portion of the light blocking film 70.

Referring to FIG. 5, the semiconductor material layer 130 is etched byusing the photosensitive film pattern 50 as a mask to form asemiconductor pattern 132.

An insulating material layer 140 is formed on the semiconductor pattern132 and the buffer layer 120. The insulating material layer 140 includesa single-layered structure including an insulating oxide of siliconoxide (SiOx), or as shown in FIG. 5, includes a multilayered structureincluding a lower layer 140 a including an insulating oxide, such assilicon oxide (SiOx), and an upper layer 140 b including an insulatingmaterial. A thickness of the insulating material layer 140 is more thanabout 1000 Å to less than about 5000 Å, but is not limited thereto.

Referring to FIG. 6, a conductive material, such as a metal, isdeposited on the insulating material layer 140 and is patterned to formthe gate electrode 154. The gate electrode 154 is formed to traverse acenter portion of the semiconductor pattern 132 such that two portionsof the semiconductor pattern 132 respectively positioned at two sides ofthe overlapping portion of the gate electrode 154 and the semiconductorpattern 132 are not covered by the gate electrode 154.

Referring to FIG. 7, the insulating material layer 140 is patterned byusing the gate electrode 154 as an etching mask to form the insulatinglayer 142. According to an embodiment, the insulating layer 142 includesa single-layered structure or a multilayered structure that includes alower layer 142 a including an insulating oxide and an upper layer 142 bincluding an insulating material.

Accordingly, the gate electrode 154 and the insulating layer 142 havethe same or substantially the same plane shape. The two portions of thesemiconductor pattern 132 that are not covered by the gate electrode 154are exposed.

According to an embodiment, the method of patterning the insulatingmaterial layer 140 includes a dry etching method in which etching gasand etching time are controlled for the buffer layer 120 to not beetched.

Referring to FIG. 8, the two exposed portions of the semiconductorpattern 132 are subjected to a reduction treatment method, therebyforming the source region 133 and the drain region 135 havingconductivity. The semiconductor pattern 132 that is covered by theinsulating layer 142 and is not reduced becomes a channel region 134.Accordingly, the gate electrode 154, the source region 133, and thedrain region 135 form the thin film transistor Q along with the channelregion 134.

According to an embodiment, the reduction treatment method includes aheat treatment method that is performed in a reduction atmosphere and agas plasma treatment using plasma, such as hydrogen (H₂), helium (He),phosphine (PH₃), ammonia (NH₃), silane (SiH₄), methane (CH₄), acetylene(C₂H₂), diborane (B₂H₆), carbon dioxide (CO₂), germane (GeH₄), hydrogenselenide (H₂Se), hydrogen sulfide (H₂S), argon (Ar), nitrogen (N₂),nitrogen oxide (N₂O), and fluoroform (CHF₃). At least a portion of thesemiconductor material forming the reduced and exposed semiconductorpattern 132 has only metallic bonding. Accordingly, the reducedsemiconductor pattern 132 has conductivity.

In the reduction treatment of the semiconductor pattern 132, themetallic component of the semiconductor material, for example indium(In), is extracted to a surface of the semiconductor pattern 132. Athickness of the extracted metal layer is less than about 200 nm.

FIG. 9 shows an example of indium (In) particles extracted to thesurface of the source region 133 and the drain region 135 when thesemiconductor material forming the semiconductor pattern 132 includesindium (In).

According to an exemplary embodiment of the present invention, aboundary between the channel region 134 and the source region 133 or aboundary between the channel region 134 and the drain region 135 isaligned or substantially aligned with an edge of the gate electrode 154or the insulating layer 142. However, in the reduction treatment of thesemiconductor pattern 132, a portion of the semiconductor pattern 132under the edge portion of the insulating layer 142 may be reduced suchthat the boundary between the channel region 134 and the source region133 or the drain region 135 may be positioned more inwardly with respectto the edge of the gate electrode 154 or the insulating layer 142.

Referring to FIG. 10, an insulating material is coated on the gateelectrode 154, the source region 133, the drain region 135, and thebuffer layer 120, thus forming the passivation layer 160. Thepassivation layer 160 is patterned to form a contact hole 163 exposingthe source region 133 and a contact hole 165 exposing the drain region135.

As shown in FIG. 1, a data input electrode 173 and a data outputelectrode 175 are formed on the passivation layer 160.

In the thin film transistor Q according to an exemplary embodiment ofthe present invention, the gate electrode 154 and the source region 133or the gate electrode 154 and the drain region 135 do not overlap orsubstantially do not overlap each other such that the parasiticcapacitance between the gate electrode 154 and the source region 133 orbetween the gate electrode 154 and the drain region 135 may bedecreased. Accordingly, the on/off characteristics of the thin filmtransistor Q as a switching element may be improved.

Referring to FIG. 11, a thin film transistor and a thin film transistorarray panel according to an exemplary embodiment of the presentinvention are described.

FIG. 11 is a cross-sectional view including a thin film transistor arraypanel including a thin film transistor according to an exemplaryembodiment of the present invention.

Referring to FIG. 11, a light blocking film 70 is positioned on aninsulation substrate 110. The light blocking film 70 prevents light fromreaching a semiconductor included in the channel region 134 such thatthe semiconductor does not lose its characteristics. According to anembodiment, the light blocking film 70 is made of a material that doesnot transmit light of a predetermined wavelength band so that light doesnot reach the semiconductor. According to an embodiment, the lightblocking film 70 is made of an organic insulating material, an inorganicinsulating material, or a conductive material, such as a metal, andaccording to an embodiment, includes a single layer or multiple layers.

A data line 115 through which a data signal is transmitted is positionedon the insulation substrate 110. According to an embodiment, the dataline 115 is made of a conductive material including metal, such as,e.g., aluminum (Al), silver (Ag), copper (Cu), molybdenum (Mo), chromium(Cr), tantalum (Ta), and titanium (Ti), or alloys thereof.

A buffer layer 120 is positioned on the light blocking film 70 and thedata line 115.

A semiconductor layer including a channel region 134, a source region133, and a drain region 135 is formed on the buffer layer 120.

The channel region 134 includes an oxide semiconductor material. Whenthe light blocking film 70 is provided, the channel region 134 overlapsthe light blocking film 70.

The source region 133 and the drain region 135 are positioned at twosides of the channel region 134. The source region 133 and the drainregion 135 face each other and are separated from each other with thechannel region 134 positioned between the source region 133 and thedrain region 135. The source region 133 and the drain region 135 areconnected to the channel region 134.

An insulating layer 142 is positioned on the channel region 134. Theinsulating layer 142 covers the channel region 134. According to anembodiment, the insulating layer 142 does not overlap or substantiallydoes not overlap the source region 133 or the drain region 135.According to an embodiment, the insulating layer 142 has asingle-layered structure or a multilayered structure. For example,according to an embodiment, the insulating layer 142 includes a singlelayer including a material, such as silicon oxide (SiOx) or siliconnitride (SiNx), or includes a lower layer of aluminum oxide (Al₂O₃) andan upper layer of silicon oxide (SiOx). According to an embodiment, theinsulating layer 142 has the characteristics of the insulating layer 142described in connection with FIGS. 1 to 10.

A gate electrode 154 is positioned on the insulating layer 142. An edgeof the gate electrode 154 and an edge of the insulating layer 142 arealigned or substantially aligned with each other.

The gate electrode 154 includes a portion overlapping the channel region134, and the channel region 134 is covered by the gate electrode 154.The source region 133 and the drain region 135 are positioned at twosides of the channel region 134 with respect to the gate electrode 154,and the source region 133 and the drain region 135 do not overlap or donot substantially overlap the gate electrode 154. Accordingly, theparasitic capacitance between the gate electrode 154 and the sourceregion 133 or the parasitic capacitance between the gate electrode 154and the drain region 135 may be decreased.

The gate electrode 154, the source region 133, and the drain region 135form the thin film transistor Q along with the channel region 134.

A passivation layer 160 is positioned on the gate electrode 154, thesource region 133, the drain region 135, and the buffer layer 120. Thepassivation layer 160 has a contact hole 163 exposing the source region133 and a contact hole 165 exposing the drain region 135. The bufferlayer 120 and the passivation layer 160 include a contact hole 161exposing the data line 115.

An organic layer 180 is further positioned on the passivation layer 160.The organic layer 180 includes an organic insulating material or a colorfilter material. The organic layer 180 has a flat surface. The organiclayer 180 includes a contact hole 183, which exposes the source region133 and corresponds to the contact hole 163 of the passivation layer160, a contact hole 185, which exposes the drain region 135 andcorresponds to the contact hole 165 of the passivation layer 160, and acontact hole 181 which exposes the data line 115 and corresponds to thecontact hole 161 of the passivation layer 160 and the buffer layer 120.As shown in FIG. 11, edges of the contact holes 183, 185, and 181 of theorganic layer 180 are respectively aligned with edges of the contactholes 163, 165, and 161 of the passivation layer 160. Alternatively, theedges of the contact holes 163, 165, and 161 of the passivation layer160 are respectively positioned in a further inward position than theedges of the contact holes 183, 185, and 181 of the organic layer 180.For example, the contact holes 163, 165, and 161 of the passivationlayer 160 are respectively positioned within the contact holes 183, 185,and 181 of the organic layer 180 when seen in plan view.

A data input electrode 173, also referred to as a source electrode, anda data output electrode 175, also referred to as a drain electrode, aredisposed on the organic layer 180. The data input electrode 173 iselectrically connected to the source region 133 of the thin filmtransistor Q through the contact hole 163 of the passivation layer 160and the contact hole 183 of the organic layer 180, and the data outputelectrode 175 is electrically connected to the drain region 135 of thethin film transistor Q through the contact hole 165 of the passivationlayer 160 and the contact hole 185 of the organic layer 180. The datainput electrode 173 is connected to the data line 115 through thecontact hole 161 of the passivation layer 160 and the contact hole 181of the organic layer 180. Accordingly, the source region 133 receives adata signal from the data line 115. According to an embodiment, the dataoutput electrode 175 forms a pixel electrode that is used to controlimage display or the data output electrode 175 is connected to aseparate pixel electrode (not shown).

A method of manufacturing the thin film transistor array panel shown inFIG. 11 according to an exemplary embodiment of the present invention isdescribed with reference to FIG. 12 to FIG. 20 as well as FIG. 11.

FIG. 12, FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17, FIG. 18, FIG. 19and FIG. 20 are cross-sectional views sequentially showing a method ofmanufacturing the thin film transistor array panel shown in FIG. 11according to an exemplary embodiment of the present invention,

Referring to FIG. 12, a light blocking film 70 made of an organicinsulating material, an inorganic insulating material, or a conductivematerial, such as a metal, is formed on an insulation substrate 110 ofglass or plastic. According to an embodiment, the formation of the lightblocking film 70 is omitted according to the condition.

A metal is deposited and patterned on the insulation substrate 110 tothereby form a data line 115. According to an embodiment, the sequenceof forming the light blocking film 70 and the data line 115 is changed.For example, the data line 115 is formed, and the light blocking film 70is then formed.

Referring to FIG. 13, a buffer layer 120, a semiconductor material layer130, an insulating material layer 140, and a gate layer 150 aresequentially deposited on the light blocking film 70 and the data line115.

The buffer layer 120 is formed by depositing an insulating oxide, suchas silicon oxide (SiOx), aluminum oxide (Al₂O₃), hafnium oxide (HfO₃),and yttrium oxide (Y₂O₃). A thickness of the buffer layer 120 is in arange from more than about 500 μm to less than about 1 μm, but is notlimited thereto.

The semiconductor material layer 130 is formed by depositing an oxidesemiconductor material, such as zinc oxide (ZnO), zinc-tin oxide (ZTO),zinc-indium oxide (ZIO), indium oxide (InO), titanium oxide (TiO),indium-gallium-zinc oxide (IGZO), and indium-zinc-tin oxide (IZTO).

The insulating material layer 140 is formed of an insulating materialincluding an insulating oxide, such as silicon oxide (SiOx). Accordingto an embodiment, the insulating material layer 140 includes asingle-layered structure or a multilayered structure including a lowerlayer 140 a including an oxide, such as silicon oxide (SiOx), and anupper layer 140 b including an insulating material. A thickness of theinsulating material layer 140 is in a range from more than about 1000 Åto less than about 5000 Å, but is not limited thereto.

The gate layer 150 is formed by depositing a conductive material, suchas aluminum (Al).

Referring to FIG. 14, a photosensitive film of a photoresist is coatedon the gate layer 150 and is exposed to light, thereby forming thephotosensitive film pattern 50. The photosensitive film pattern 50includes, as shown in FIG. 14, a first portion 52 having a relativelylarge thickness and a second portion 54 having a relatively smallthickness. The first portion 52 of the photosensitive film pattern 50overlaps the light blocking film 70. Two sides of the second portion 54,which are separated and face each other with respect to the firstportion 52, are respectively connected to two sides of the first portion52 of the photosensitive film pattern 50.

The photosensitive film pattern 50 is formed by an exposing processusing a photomask (not shown) including a transflective region. Forexample, the photomask for forming the photosensitive film pattern 50includes a transmission region that transmits light, a light blockingregion that blocks light, and a transflective region that transmits partof light. According to an embodiment, the transflective region is formedof a slit or a translucent layer.

When the exposing process is performed by using the photomask includingthe transflective region and using a negative photosensitive film, aportion corresponding to the transmission region of the photomask isirradiated with light such that the photosensitive film remains therebyforming the first portion 52 having a relatively large thickness, aportion corresponding to the light blocking region of the photomask isblocked from light irradiation such that the photosensitive film isremoved, and a portion corresponding to the transflective region of thephotomask is partially irradiated with light such that the secondportion 54 having a relatively small thickness is formed. When apositive photosensitive film is used for the exposing process, a portioncorresponding to the transmission region of the photomask is irradiatedwith light such that the photosensitive film is removed, a portioncorresponding to the light blocking region of the photomask is blockedfrom light irradiation such that the photosensitive film remains therebyforming the first portion 52 having a relatively large thickness, and aportion corresponding to the transflective region of the photomask ispartially irradiated with light such that the second portion 54 having arelatively small thickness is formed. As such, irrespective of whether anegative photosensitive film or positive photosensitive film is used forthe exposing process, the portion corresponding to the transflectiveregion of the photomask is subjected to partial light irradiation, thusresulting in the second portion 54 of the photosensitive film pattern50.

Referring to FIG. 15, the gate layer 150 and the insulating materiallayer 140 are sequentially etched by using the photosensitive filmpattern 50 as an etching mask. According to an embodiment, the gatelayer 150 is etched through a wet etching method, and the insulatingmaterial layer 140 is etched through a dry etching method. Accordingly,the gate pattern 152 and the insulating pattern 141 having the sameplane shape are formed under the photosensitive film pattern 50. Thesemiconductor material layer 130 that is not covered by thephotosensitive film pattern 50 is exposed.

Referring to FIG. 16, the exposed semiconductor material layer 130 isremoved by using the gate pattern 152 and the insulating pattern 141 asan etching mask to thereby form a semiconductor pattern 132. Thesemiconductor pattern 132 has the same plane shape as the gate pattern152 and the insulating pattern 141.

Referring to FIG. 17, the photosensitive film pattern 50 is etchedthrough an ashing method using oxygen plasma so that the second portion54 is removed and a thickness of the photosensitive film pattern 50 isreduced. Accordingly, the first portion 52 with the reduced thicknessremains thereby resulting in a photosensitive film pattern 50′.

Referring to FIG. 18, the gate pattern 152 and the insulating pattern141 are sequentially etched by using the photosensitive film pattern 50′as an etching mask. Accordingly, the semiconductor pattern 132 that isnot covered by the photosensitive film pattern 50′ is exposed. Theexposed semiconductor pattern 132 is positioned at two sides of thesemiconductor pattern 132 that is covered by the photosensitive filmpattern 50′.

Referring to FIG. 19, the semiconductor pattern 132 undergoes areduction treatment to thereby form the source region 133 and the drainregion 135 having conductivity. The semiconductor pattern 132 covered bythe insulating layer 142 is not reduced thereby forming the channelregion 134.

The gate electrode 154, the source region 133, and the drain region 135form the thin film transistor Q along with the channel region 134.

According to an embodiment, the reduction treatment method includes aheat treatment method that is performed in a reduction atmosphere and agas plasma treatment using plasma, such as hydrogen (H₂), argon (Ar),nitrogen (N₂), nitrogen oxide (N₂O), and fluoroform (CHF₃). At least aportion of the semiconductor material forming the reduced and exposedsemiconductor pattern 132 has only metallic bonding. Accordingly, thereduced semiconductor pattern 132 has conductivity.

In the reduction treatment of the semiconductor pattern 132, themetallic component of the semiconductor material, for example indium(In), is extracted to a surface of the semiconductor pattern 132. Athickness of the extracted metal layer is less than about 200 nm.

According to an exemplary embodiment of the present invention, aboundary between the channel region 134 and the source region 133 or aboundary between the channel region 134 and the drain region 135 isaligned or substantially aligned with an edge of the gate electrode 154or the insulating layer 142. However, in the reduction treatment of thesemiconductor pattern 132, a portion of the semiconductor pattern 132under the edge portion of the insulating layer 142 may be reduced suchthat the boundary between the channel region 134 and the source region133 or the drain region 135 may be positioned more inwardly with respectto the edge of the gate electrode 154 or the insulating layer 142.

Referring to FIG. 20, after removing the photosensitive film pattern50′, an insulating material is coated on the gate electrode 154, thesource region 133, the drain region 135, and the buffer layer 120 tothereby form a passivation layer 160. An organic insulating material iscoated on the passivation layer 160, thus forming the organic layer 180.

As shown in FIG. 11, contact holes 163, 165, 161, 183, 185, and 181 areformed in the passivation layer 160 and the organic layer 180, and adata input electrode 173 and a data output electrode 175 are formed onthe organic layer 180.

When forming the contact holes 163, 165, 161, 183, 185, and 181 in thepassivation layer 160 and the organic layer 180, one or two masks areused. For example, the organic layer 180 is exposed by using onephotomask to form the contact holes 183, 185, and 181 of the organiclayer 180, and then contact holes 163, 165, and 161 of the passivationlayer 160 are formed that, when viewed in plan view, are respectivelypositioned within the contact holes 183, 185, and 181 of the organiclayer 180 by using another photomask. Edges of the contact holes 163,165, and 161 of the passivation layer 160 are respectively aligned withedges of the contact holes 183, 185, and 181 of the organic layer 180.

FIG. 21 is a graph illustrating a voltage-current characteristic of athin film transistor according to an exemplary embodiment of the presentinvention, and FIG. 22 is a graph illustrating a voltage-currentcharacteristic according to various source-drain voltages of a thin filmtransistor according to an exemplary embodiment of the presentinvention.

Referring to FIG. 21, an on/off transition of the source-drain current(Ids) according to the gate electrode voltage (Vg) in a thin filmtransistor Q according to an exemplary embodiment of the presentinvention is distinctly identified at a threshold voltage, and an ONcurrent is relatively high, which means that the characteristics of thethin film transistor Q as a switching element are improved.

Referring to FIG. 22, a thin film transistor Q according to an exemplaryembodiment of the present invention experiences no or little change inthe threshold voltage according to a change in the source-drain voltage(Vds), such that the thin film transistor Q may maintain uniformcharacteristics as a switching element.

As described above, according to the exemplary embodiments of thepresent invention, the gate electrode 154 and the source region 133 ofthe thin film transistor Q or the gate electrode 154 and the drainregion 135 of the thin film transistor Q do not overlap or substantiallydo not overlap each other such that the parasitic capacitance betweenthe gate electrode 154 and the source region 133 or the parasiticcapacitance between the gate electrode 154 and the drain region 135 maybe decreased. Accordingly, the ON current and the mobility of the thinfilm transistor may be increased and the on/off characteristics of thethin film transistor Q as a switching element may be improved. As aresult, a display device with the thin film transistor may have areduced RC delay. Accordingly, the thickness of the driving signal linesmay be decreased, thus resulting in savings in manufacturing costs.Further, the characteristics of the thin film transistor itself areimproved, resulting in a reduced size of the thin film transistor and anincreased margin for forming a minute channel.

While the embodiments of the invention have been described, it is to beunderstood that the invention is not limited to the disclosedembodiments, but on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims.

What is claimed is:
 1. A thin film transistor, comprising: a lightblocking layer; an oxide semiconductor disposed on the light blockinglayer; a source region and a drain region positioned at two oppositesides with respect to the oxide semiconductor; an insulating layer whichis positioned on and covers the oxide semiconductor; a gate electrodepositioned on the insulating layer; a passivation layer disposed on thegate electrode; and a data input electrode and a data output electrodedisposed on the passivation layer, wherein the data input electrode isconnected to the source region, and the data output electrode isconnected to the drain region.
 2. The thin film transistor of claim 1,wherein an edge of the gate electrode is substantially aligned with anedge of the insulating layer.
 3. The thin film transistor of claim 2,wherein the passivation layer directly contacts a side surface of theinsulating layer.
 4. The thin film transistor of claim 1, furthercomprising a buffer layer disposed between the light blocking layer andthe oxide semiconductor.
 5. The thin film transistor of claim 2, whereinthe buffer layer or the insulating layer includes an insulating oxide.6. A thin film transistor panel, comprising: an insulation substrate; alight blocking layer; an oxide semiconductor positioned on the lightblocking layer; a source region and a drain region positioned at twoopposite sides with respect to the oxide semiconductor; an insulatinglayer which is positioned on and covers the oxide semiconductor; a gateelectrode positioned on the insulating layer; a passivation layerdisposed on the gate electrode; and a data input electrode and a dataoutput electrode disposed on the passivation layer, wherein the datainput electrode is connected to the source region, and the data outputelectrode is connected to the drain region.
 7. The thin film transistorof claim 6, wherein an edge of the gate electrode is substantiallyaligned with an edge of the insulating layer.
 8. The thin filmtransistor of claim 7, wherein the passivation layer directly contacts aside surface of the insulating layer.
 9. The thin film transistor ofclaim 6, further comprising a buffer layer disposed between the lightblocking layer and the oxide semiconductor.
 10. The thin film transistorof claim 7, wherein the buffer layer or the insulating layer includes aninsulating oxide.